News

Successful collaboration of AMAT ADIXEN and DMS on AMC prevention

Common presentation at 21st Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010)

We have identified an issue where VOCs (volatile organic compounds) being absorbed in a FOSB were generating spherical shaped organic particles on the wafers during the wafer transportation. Upon completion of several experiments, a treatment using adixen vacuum system to out-gas the VOC contaminants from the FOSB was found to be effective to suppress this organic particle generation during the wafer transportation.