Technical publications
VOC Induced Particle Generation during Wafer shipping & Its Solutions
"21st Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010), July 11-13, 2010, San Francisco, California" - Abstract
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In this paper, first published at the 21st Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010), we describe a particle generation issue on 300mm wafers during wafer shipping and transportation while using a FOSB (Front Opening Shipping Box) for the wafer shipping container. The analysis work associated with this defect generation issue and its prevention scheme will also be discussed.
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